JPH0755008Y2 - 発光ダイオード - Google Patents

発光ダイオード

Info

Publication number
JPH0755008Y2
JPH0755008Y2 JP1989088611U JP8861189U JPH0755008Y2 JP H0755008 Y2 JPH0755008 Y2 JP H0755008Y2 JP 1989088611 U JP1989088611 U JP 1989088611U JP 8861189 U JP8861189 U JP 8861189U JP H0755008 Y2 JPH0755008 Y2 JP H0755008Y2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting element
emitting diode
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989088611U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328764U (en]
Inventor
好伸 末広
繁 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
iwasakidenki
Original Assignee
iwasakidenki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by iwasakidenki filed Critical iwasakidenki
Priority to JP1989088611U priority Critical patent/JPH0755008Y2/ja
Publication of JPH0328764U publication Critical patent/JPH0328764U/ja
Application granted granted Critical
Publication of JPH0755008Y2 publication Critical patent/JPH0755008Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1989088611U 1989-07-28 1989-07-28 発光ダイオード Expired - Lifetime JPH0755008Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989088611U JPH0755008Y2 (ja) 1989-07-28 1989-07-28 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989088611U JPH0755008Y2 (ja) 1989-07-28 1989-07-28 発光ダイオード

Publications (2)

Publication Number Publication Date
JPH0328764U JPH0328764U (en]) 1991-03-22
JPH0755008Y2 true JPH0755008Y2 (ja) 1995-12-18

Family

ID=31638213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989088611U Expired - Lifetime JPH0755008Y2 (ja) 1989-07-28 1989-07-28 発光ダイオード

Country Status (1)

Country Link
JP (1) JPH0755008Y2 (en])

Also Published As

Publication number Publication date
JPH0328764U (en]) 1991-03-22

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